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.
PREPARED BY:
DATE
SPEC No.
ED-93033 April 9, 1993
DIVISION DJV COMPONENTS DIV.
I-), Ti&Grr~A
APPROVED c-' ?. .r BY: ,., f ,I..
qp-; I 9 1993
DATE /: it!.. s ,I ! ,; I
SHARI=
_ -ELECTRONIC SHARP CORPORATION
FILE No. ~~ ISSUE
PAGE
--
COMPONENTS CROUP
12 Pages
REPRESENTATIVE
q PHOTOVOLTAICS DIV. q OPTO-ELECTRONIC DEVICES
n ELECTRONIC
1
SPECIFICATION
10
w
'
DEVICE
SPECIFICATION
FOR
PHOTOCOUPLER
hiODEL No.
1.
This specification sheets include the contents under the copyright of Please keep them with reasonable care as sharp Corporation ("Sharp"). important information. Please don't reproduce or cause anyone reproduce
:hem \;i'thout Sharp's consent. mentioned below for actual use of this device. Dlease (1) This Main obey the instructions
2.
device is designed for general electronic uses of this device are as follows; .
equipment. (Terminal)
- Computer * OA equipment -Telecommunication equipment * AV equipment - Measuring equipment -Tooling machine etc. C- Home appliance, (Zj Please take proper steps in order to maintain reliability in case this device is used for the uses mentioned below high reliability. -Unit concerning control and safety of a vehicle automobile etc.) * Gas leak detection breaker *Other safety i -Fire box and burglar alarm box (2) Please don't use for the uses mentioned extremely high reliability Telecommunication Medical element), etc. below equipment equipment
1
I
and safety, which require
(air plane, train, - Traffic signal equipment, etc.. which require
(Trunk) (relating
to any fatal
1
0 CLJSTG:6RR'S
APPROVAL
DATE
BY
T. Matsumura, Department General Manager of Engineering Dept., TI Opto-Electronic Devices Div. ELECOMGroup SHARP CORPORATION
MODEL
No.
PACE
PC3Q67
1
i.
Application This specification photocoupler Model applies to the outline No. PC3Q67. and characteristics of
2.
Outline Refer to the attached and characteristics maximum ratings Ta=25"C Parameter --------_ Forward current Peak forward Reverse voltage current / Symbol IF Im "R P voltage voltage "CEO VECO Ic /2..-*l Total power dissipation I i' i Ptot Topr Tstg Operating temperature ___Storage temperature -__-_-_--______ Isolation voltage -_~.--Soldering temperature --___. --__ ) i j ! ! 1 I 1 j 1 f , 1 Rating 50 1 6 70 35 6 50 150 170 -30 % +lOO -40 'L +125 / I Unit mA A V mW " i , drawing No. CY5890K02.
3.
Ratings 3.1
Absolute
*1 *2 iInput / ; *1 / !
Power dissipation Collector-emitter
I ioutput ! ! 1
Emitter-collector Collector *l Collector current
power dissipation
( "1 1 I* 1 mW j I i LUW ' ! OC
*3 *4 *1 *2 *3 *4
The derating temperature Pulse AC for width lmin.,
factors of absolute maximum are shown in Fig. 1 'L 4. < lOOus, Duty ratio : 0.001
rating (Refer
due to ambient to Fig. 5)
40 ,-I, 60%RH, f=60Hz
For 10 s
MODEL
hb. PC3Q67
PACE 2
l
3.2
Electra-optical
characteristics Ta=25"C ----T----Symbol MIN. I VF , I TYP. i 1.2 1 ! MAX. 1.4 ' 10 Unit Conditions
-1
Input
Parameter ----.---+--Forward voltage Reverse current Terminal capacitance
v ?F=20mA I 1 pA `VR=4V
f / 1 ICE0 / / -
I 250
Dark current output
I
100
i I I I 'V=O, f=lkHz i pF I I ti /vCE=20v, IF'0 1 !
Collector-emitter breakdown voltage
i I Emitter-collector
brakdown voltage Collector current
Transfer characterostocs
Collector-emitter saturation voltage ------Isolation resistance
Response time (Rise)
r /
tr I tf
j,
14
18 3
1 US jVCE=2V
I
L
Response time (Fall)
/
-
18
ps
'Ic=2mA RL=lOOQ
j
4.
Reliability Refer to the attached sheet, Page 7.
5.
Incoming Refer
inspection to the attached sheet, Page 8.
6.
Supplements 6.1 ( 1) (2) (3) Isolation voltape shall be measured in the following method. side and side. circuit shall
Short between anode and cathode on the primary between collector and Emitter on the secondary The dielectric be used. withstand tester with zero-cross
The waveform of applied (It is recommended that in insulation oil) (1) (2) (3) This This This product product product specifications to the attached
voltage shall the isolation
be a sine wave. voltage be measured
6.2
is not designed is assembled incorporates
with
as radiation electrical light
hardened. input and output. diode.
non coherent
emitting
6.3
Package Refer
sheet,
Page 9 to 11.
6.4
uL : Under
preparation
MODEL No. PC3Q67
PAGE 4
7.
Notes 7.1 For cleaning * Cleaning (1) (2) Solvent Ultrason conditions: cleaning: ic c 1 eaning: Solvent temperature 45C or less Immersion 3 min. or less Affection to device by ultrasonic cleaning has different affection by cleaning bath size, ultrasonic power output, cleaning time, PWB size If user or device mounting condition etc. carries out ultrasonic cleaning, user should select fit condition that doesn't occur defect. be Carrie Ethyl Freon out with solvent below. Isopropyl S3-E alcohol
* The cleaning Solvent:
shall
alcohol, Methyl alcohol, TE.TF, Daiflon-solvent
Please refrain from using Chloro Fluoro Carbon type solvent to clean devices as much as possible since it is restricted to protert the ozonosphere. Before you use alternative solvent you are requested to confirm that it does not damage package resin. 7.2 On mounting In mounting this device, please perform soldering reflow satisfied with the conditions indicated in page 12. And please pay attention not to occur the temperature rising of the package sectionally.
8.
Others Any doubt as to this specification shall be determined upon mutual consultation of the both parties. in good faith
PC3Q67
Page 5
Date
code
*1 .2 Pin Nos. connection and internal diagram
Pti3Q67
W
m d ti \,f i
c 0.4 Epoxy'resin
&
*I)
Date code is composed of 2-digit number marked according to DIN standard and t'lie following weekly-code . First week : 1 Second week : 2 Third week : 3 Fouth week : 4 UNIT :1/l mm Fifth, Sixth week : 5 Name P-Q67 Outline Dimensions Drawin CY589OKO2 No.
.;
PC3Q67
Page 6
Fig.
1
Forward ambient
current vs. temperature
Fig.
2
Diode power dissipation temperature vs. ambient I I I I I
1
SO 40
Y
looI-i--l-l--t-1-1
/ -
I
30-20 10 -`JO- 0
Fig. r\ 3
-
80. 70 60 -
I
\
\
--t-I
i~t-b 55 75 100
40 20 -030
Fig.
Ambient
25
temperature
Ta ("C)
Ambi!nt 4
fzmper?tur!
Ty"(OC)
Collector power dissipation vs. ambient temperature
Total power dissipation vs. ambient temperature
200 -. 170 150 100 50--. \
..--
.
-30
Pig. 5
Ambient
0
temperature
25
50
75
Ta ("C)
100
01111111 -30
Ambi!ent
~?rnpe?!atu~~
?!'("C)
Peak forward current vs. duty ratio Pulse width 5 100~s Ta - 25C
i
Duty ratio
PAGE
4.
Reliability The reliability
of
products
shall
be satisfied Confidence
with level
items
listed
below.
: 90%, LTPD : 10X/20%
I !
Test
Items
Test
Conditions
; Solderability i Soldering heat
*l *2
23O"C, 260C
5s 10 s VF > u X 1.2
IR>uX
n=ll, n=ll,
C=O C=O
.: Terminal ! strength : (Bending) *3 / ! Mechanical shock /. I Variable ! vibration frequency
Weight : lNiO.lkgf} 1 time/each termianl 15000m/sZ~1500G~, 0.5ms 3 times/s, ?Y, +Z direction 100 'L 2000 Q 100 Hz/4 4 times/X,Y Z direction / 200m/sZ{20G] ' 1 cycle min.
2 >u
X
ICE0 Ic
2
< L x 0.7
> u x 1.2
j Temperature 1 cycling
-40C --I, +125"C (30min.) (30min.) 20 cycle test
*l *2 *3
Solder shall lead and pin The lead pin root of lead Terminal
--adhere at the area of 95% or more of immersed hole or other holes shall not be concentrated depth pins. dipped (Refer direction into solder shall to the below) is shown below. be away
,
portion of on one portion. the
0.2mm from
bending
0.211~s or more :.-i...<.;x-.. .+Soldering area Weight t : lNfO.lkgf]
I
5. Incoming 5.1 inspection Inspection (1) Electrical VF, IR, (2) Appearance items characteristics
1~~0% VCE(sat), Ic, Rise,
IMODEL No.
1PAGE
PC3Q67
I
8
vim
5.2
Sampling
method
and Inspection
level based on inspection
A single sampling plan, MIL-STD-105D is applied. items are shown below. Defect Major defect I I I I i
i
normal inspection level II The AQL according to the
Inspection Electrical Unreadable
item
characteristics marking
_---
/
I
I Inspection I I / Normal I inspection I
!
I
level
AQL(%)
II
I
0.1
t
' Minor defect
/ ;
Appearance defect except the above mensioned.
, i
Normal inspection
II
0.4
I
6.2 Package specifications conditions (Refer to the attached sheet,
PC3Q67
I
g
6.3.1 ill
Taping
Page 10)
Tape structure
and Dimensions tape is sealed heatto protect against sheet, its Page 11) dimensions Page 11)
The tape shall have a structure in which a cover pressed on the carrier tape of hard vinylchloride static electricity. (2) Reel structure and Dimensions (Refer
to the attached cardboard with
The taping reel shall be of corrugated as shown in the attached drawing. (3) Direction of product insertion (Refer tape shall
to the attached direct
sheet,
Product direction in carrier the hole side on the tape. (4) Joint of tape tape and carrier
to the anode mark at
The cover iS>
tape in one reel devices
shall
be jointless.
The way to repair
taped failure
The way to repair taped failure devices cut a bottom of carrier and after replacing to good devices, the cutting with a cutter, shall be sealed with adhesive tape. 6.2.2 Adhesiveness of cover tape shall
tape portion
The exfoliation force between carrier tape and cover tape 0.2N{20gf)s lN{lOOgf]for the angle from 160" to 180". 6.2.3 Rolling method and quanfity
be
Wind the tape back on the reel so that the cover tape will be outside Attach more than 20cm of blank tape to the trailer and the the tape. leader of the tape and fix the both ends with adhesive tape. One reel shall contain 1000 PCS. 6.2.4 Marking The outer packaging case shall be marked with following information. date
* Model No. 6.2.5 Storage condition
* Number of pieces
delivered
* Production
Taped procuts shall be stored at the temperature 5 Q 30C and the humidities lower than 7O%RH. 6.2.6 Safety protection during shipping
lower
than
There shall be no deformation of component characteristecs due to shipping.
or degradation
of electrical
PC3Q67
Page
10
TapL
structure
and Dimensions
J
K -
-_
-z I A
I
I
L i
I
, ..,
L
Somax
Dimension
A
list
C
-(Unit D
:' mm) E F G H I 10. 8+-O. 1
21. oto. 3 J
11.5&O. 1 1.75to.i
12.0~0. 1 2. o-co. 1 4. wo. 1 41. 5 fb'
K
L 7.420. 1
0. 410. 05 3. oio. 1
PC3Q67
Page 11
Ret1
structure
and Dimensions
a ,' t -4
Dimension
list
(Unit c 1rjtEl.O
: mm) d 13io.5 e 23kl.O f 2.OkO.5 g 2.oa5 L
a b 330 25.51-1.5
Direction
of product
insertion
MODEL
No.
PAGE
PC3Q67
12
Precautions 1. If solder reflow:
for
Soldering
Photocouplers
It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure.
23O'C
2ooc
180':
23:
L
i- ---
2 min. _
pp
/ *l +-----q 1.5 min.
i ,&-1_min. -----+ minY /
;
2.
Other
An
precautions
infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item 1. Also avoid immersing the resin part in the solder.

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